LED packaging technology

LED products, a variety of color temperature, refers to the variety there are specifications, through a variety of packages to achieve, for example, is a different structure and appearance devices. Observe whether the package with a pin, LED can be divided into pin-type packaging and surface mount package two types. Because power LED must be the core of future semiconductor lighting, so its packaging is also a hot spot for people to study. Here are a few major packages to explain the form:

The first: pin-type package using lead frame as a variety of package appearance of the pin. Round pin LED is a commonly used package. This type of packaging technology generally use epoxy resin or silicone as a packaging material, heat dissipation of nearly 90% of the chip heat will lead to the PCB through the lead frame, and then volatile to the surrounding air. The diameter of the epoxy resin is 7mm, 5mm, 4mm, 3mm and 2mm and other specifications. Beam angle range of up to 20 ~ 120 °.

The second: surface-mount package It is a sub-pin-type package developed after an important way of packaging. It is usually made of plastic with a lead-chip carrier, the LED chip on the top of the groove, the bottom sealed with metal chip pins. With this packaging technology package LED, in the brightness, viewing angle, flatness, consistency, practicality have been resolved, so the majority of LED manufacturers to use, as LED packaging technology is an important development direction.

The third: power LED package power LED sub-1W below the ordinary power LED and 1W above the two power watt LED. Among them, more than 1W tile power LED is the future development of the most important lighting. Single-chip tile power LED was first produced by the United States Lumileds company in 1998 LUXEON LED, the use of thermoelectric separation is the way this package structure, the flip chip with silicon carrier welding in the heat sink, and the use of reflective cup , Optical lenses and flexible transparent plastic and other new structures and new materials.